Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)

Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)

US Patent 10173893 · Granted Jan 8, 2019

Estimated economic value: $437,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

All-electronic high-throughput analyte detection system2024
All-electronic high-throughput analyte detection system2024
Acoustic relief in MEMS2022
All-electronic high-throughput analyte detection system2021
All-electronic high-throughput analyte detection system2021
Differential z-axis resonant accelerometry2021
Multiple-axis resonant accelerometers2020
Method and apparatus for driving a multi-oscillator system2019
Method and apparatus for driving a multi-oscillator system2019
Membrane transducer structures and methods of manufacturing same using thin-film2018
Membrane transducer structures and methods of manufacturing same using thin-film2018
Membrane transducer structures and methods of manufacturing same using thin-film2018