Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of fluxless micro-piercing of solder balls, and resulting devices

Methods of fluxless micro-piercing of solder balls, and resulting devices

US Patent 10163840 · Granted Dec 25, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of fluxless micro-piercing of solder balls, and resulting devices2019
Multilayer structure for a semiconductor device and a method of forming a multil2017
Computer systems having an interposer including a flexible material2016
Microelectronic devices and methods for manufacturing microelectronic devices2015
Microelectronic devices and microelectronic support devices, and associated asse2015
Microelectronic devices and microelectronic support devices, and associated asse2014
Microelectronic devices and methods for manufacturing microelectronic devices2014
Methods of fluxless micro-piercing of solder balls, and resulting devices2014
Microelectronic devices and methods for manufacturing microelectronic devices2013
Partitioned through-layer via and associated systems and methods2013
Elimination of RDL using tape base flip chip on flex for die stacking2013
Methods of fluxless micro-piercing of solder balls, and resulting devices2013