Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion

Method for forming BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion

US Patent 10163697 · Granted Dec 25, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultralow-K dielectric-gap wrapped contacts and method2024
Integrated circuit including wire structure, related method and design structure2019
Semiconductor chip with anti-reverse engineering function2018
Test structure for monitoring interface delamination2018
Semiconductor chip with anti-reverse engineering function2018
Integrated circuit including wire structure, related method and design structure2017
Laser scribe structures for a wafer2017
Semiconductor chip with anti-reverse engineering function2017
Structure for BEOL metal levels with multiple dielectric layers for improved die2017
Structure for BEOL metal levels with multiple dielectric layers for improved die2017
Structure for BEOL metal levels with multiple dielectric layers for improved die2017
Structure for BEOL metal levels with multiple dielectric layers for improved die2017