Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and system for preventing backside peeling defects on semiconductor wafers

Apparatus and system for preventing backside peeling defects on semiconductor wafers

US Patent 10163676 · Granted Dec 25, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Photoresist and method2025
In-situ deposition and densification treatment for metal-comprising resist layer2025
Image sensor having an improved structure for small pixel designs2025
Photoresist layer surface treatment, cap layer, and method of forming photoresis2025
Vertical gate field effect transistor2025
Methods and devices for geometric partition mode with motion vector refinement2025
Multiplexing techniques for overlapping channels with different priorities2025
Gas distribution assembly including positioning device2025
Planar mode improvement for intra prediction2025
Method for video encoding with residual and coefficients coding, computing devic2025
Gate structures for semiconductor devices2025
Apparatus and method for manufacturing metal gate structures2025