Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for integrating a compliant material with a substrate

Methods for integrating a compliant material with a substrate

US Patent 10101857 · Granted Oct 16, 2018

Estimated economic value: $96,757,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method of wireless headset2025
Semiconductor structure formation2025
Post gate dielectric processing for semiconductor device fabrication2025
Method of manufacturing semiconductor devices and semiconductor devices2025
Forming low-resistance capping layer over metal gate electrode2025
Chip structure with conductive layer2025
Semiconductor device structure and method for forming the same2025
Semiconductor device and a method for fabricating the same2025
Methods of forming silicon carbide coated base substrates at multiple temperatur2024
Semiconductor device having a metal pad and a protective layer for corrosion pre2024
Multi-layer high-k gate dielectric structure2024
Forming low-resistance capping layer over metal gate electrode2024