Assignee
Inventors
- Qin Cai (13 patents)
- Da-Jung Chen (65 patents)
{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Packaging process of electronic component", "item": "https://www.patentleaderboard.com/patent/10083925"}]}
Skip to contentUS Patent 10083925 · Granted Sep 25, 2018