Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Conductive-layer-integrated flexible printed circuit board

Conductive-layer-integrated flexible printed circuit board

US Patent 10045433 · Granted Aug 7, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermosetting resin composition, thermosetting resin film, thermoset film, multi2025
Low dielectric resin composition, molded article, film, multilayer film and flex2024
Thermosetting resin composition, cured film and method for producing same, and f2021
Black resin composition, polyimide with black resin cured film and production me2020
Reinforcing-plate-integrated flexible printed circuit board2019
Reinforcing-plate-integrated flexible printed circuit board2019
Black photosensitive resin composition and use of same2018
Black photosensitive resin composition and use of same2018
Resin composition for pigment-containing insulating film, and use thereof2018
Photosensitive resin composition and use thereof2017
Photosensitive resin composition and use thereof2017
Conductive-layer-integrated flexible printed circuit board2017