| 10292262 |
Reinforcing-plate-integrated flexible printed circuit board |
Masayoshi Kido |
2019-05-14 |
| 10045433 |
Conductive-layer-integrated flexible printed circuit board |
Masayoshi Kido |
2018-08-07 |
| 10030133 |
Black photosensitive resin composition and use of same |
Masayoshi Kido |
2018-07-24 |
| 9957390 |
Resin composition for pigment-containing insulating film, and use thereof |
— |
2018-05-01 |
| 9835942 |
Photosensitive resin composition and use thereof |
Tomohiro Koda, Tetsuya Kogiso, Masayoshi Kido |
2017-12-05 |
| 9723708 |
Conductive-layer-integrated flexible printed circuit board |
Masayoshi Kido |
2017-08-01 |
| 9458279 |
Resin composition and use thereof |
— |
2016-10-04 |
| 9332653 |
Resin composition for insulating film, and use thereof |
— |
2016-05-03 |
| 9267004 |
Polyimide precursor composition and use thereof |
Koji Okada |
2016-02-23 |
| 9237645 |
Flexible printed circuit integrated with conductive layer |
Masayoshi Kido |
2016-01-12 |
| 9204528 |
Flexible printed circuit integrated with stiffener |
Masayoshi Kido |
2015-12-01 |
| 9081276 |
Photosensitive resin composition production kit, and use thereof |
Tomohiro Koda, Tetsuya Kogiso |
2015-07-14 |
| 9072177 |
Conductive layer integrated FPC |
Masayoshi Kido |
2015-06-30 |
| 8993897 |
Photosensitive resin composition and use thereof |
— |
2015-03-31 |
| 8883894 |
Insulating film and printed wiring board provided with insulating film |
— |
2014-11-11 |
| 8828525 |
Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate |
Masayoshi Kido, Tetsuya Kogiso |
2014-09-09 |
| 8754186 |
Polyimide precursor composition, use thereof and production method thereof |
Kan Fujihara, Tetsuya Kogiso |
2014-06-17 |
| 8729402 |
Polyimide precursor composition, use of the of the same, and production method of the same |
— |
2014-05-20 |