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Home › Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant

Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant

US Patent 10044003 · Granted Aug 7, 2018

Estimated economic value: $8,360,000 ⓘ

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