Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device

Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device

US Patent 10043996 · Granted Aug 7, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Translation device2025
Generation device and normalization model2025
Power cable, and method for manufacturing power cable2024
Insulating resin composition and production method therefor, insulating tape and2024
Thermoplastic resin film2023
Insulating tape for coating connection portion of power cable, method for formin2023
Electrically conductive adhesive agent composition, and electrically conductive 2022
Electrically conductive adhesive film and dicing-die bonding film using the same2022
Electrically conductive adhesive film and dicing-die bonding film using the same2021
Electrically conductive adhesive film and dicing-die bonding film using the same2021
Resin composition for sealing organic electronic device element, resin sheet for2021
Resin composition for sealing organic electronic device element, resin sheet for2021