Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier

Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier

US Patent 10000423 · Granted Jun 19, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrical contact for semiconductor package2023
Metal tab for chip assembly2023
Heat transfer plate having small cavities for taking up a thermal transfer mater2019
Power semiconductor device module having mechanical corner press-fit anchors2019
Heat transfer plate having small cavities for taking up a thermal transfer mater2019
Power semiconductor device module having mechanical corner press-fit anchors2018
Inverse diode stack2018
Power semiconductor device module baseplate having peripheral heels2018
Bridging DMB structure for wire bonding in a power semiconductor module2017
Bridging DMB structure for wire bonding in a power semiconductor device module2016
Electrically isolated power semiconductor package with optimized layout2015
Electrically isolated power semiconductor package with optimized layout2014