Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408407 | Metal oxide semiconductor with multiple drain vias | CHUNG-HSIUNG HO, Chih-Hung Chang | 2025-09-02 |
| 12288737 | Thin semiconductor packaging unit having a plurality of bridging layers | CHUNG-HSIUNG HO | 2025-04-29 |
| 12224228 | Packaged component with composite pin structure and manufacturing method thereof | Yung-Hui Wang, CHUNG-HSIUNG HO | 2025-02-11 |
| 12148675 | Power semiconductor package unit of surface mount technology including a plastic film covering a chip | CHUNG-HSIUNG HO, Wei-Ming Hung, Wen-Liang Huang, Shun-Chi Shen, Chien-Chun Wang | 2024-11-19 |
| 11916030 | Method for manufacturing side wettable package | CHUNG-HSIUNG HO | 2024-02-27 |
| 11848254 | Method for manufacturing a semiconductor package having a conductive pad with an anchor flange | CHUNG-HSIUNG HO | 2023-12-19 |
| 11664345 | Semiconductor package element | CHUNG-HSIUNG HO, Chih-Hung Chang | 2023-05-30 |
| 11594425 | Semiconductor package structure and fabricating method of the same | CHUNG-HSIUNG HO | 2023-02-28 |
| 11562947 | Semiconductor package having a conductive pad with an anchor flange | CHUNG-HSIUNG HO | 2023-01-24 |
| 11387203 | Side wettable package | CHUNG-HSIUNG HO | 2022-07-12 |