Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8193091 | Resin encapsulated semiconductor device and method for manufacturing the same | Fumihiko Kawai, Toshiyuki Fukuda, Masanori Minamio, Noboru Takeuchi, Katsushi Tara +1 more | 2012-06-05 |
| 7952177 | Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads | Tomoki KAWASAKI, Yuichiro Yamada, Toshiyuki Fukuda | 2011-05-31 |
| D600219 | Lead frame | Akira Oga | 2009-09-15 |
| 7508055 | High heat release semiconductor and method for manufacturing the same | Yutaka Katou, Akira Oga, Hideki Sakoda | 2009-03-24 |
| 6633077 | Semiconductor device and method for manufacturing the same | Kenichi Itoh | 2003-10-14 |