Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7728414 | Lead frame and resin-encapsulated semiconductor device | Kouji Omori | 2010-06-01 |
| 7508055 | High heat release semiconductor and method for manufacturing the same | Yutaka Katou, Akira Oga, Shuichi Ogata | 2009-03-24 |