Issued Patents All Time
Showing 51–62 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5776800 | Paddleless molded plastic semiconductor chip package | William Hamburgen, Yezdi Dordi | 1998-07-07 |
| 5629840 | High powered die with bus bars | William Hamburgen, Norman Paul Jouppi | 1997-05-13 |
| 5604376 | Paddleless molded plastic semiconductor chip package | William Hamburgen, Yezdi Dordi | 1997-02-18 |
| 5582242 | Thermosiphon for cooling a high power die | William Hamburgen, Norman Paul Jouppi | 1996-12-10 |
| 5445697 | Fixture and method for attaching components | William Hamburgen | 1995-08-29 |
| 5386143 | High performance substrate, electronic package and integrated circuit cooling process | — | 1995-01-31 |
| 5247426 | Semiconductor heat removal apparatus with non-uniform conductance | William Hamburgen | 1993-09-21 |
| 5243756 | Integrated circuit protection by liquid encapsulation | William Hamburgen | 1993-09-14 |
| 5240549 | Fixture and method for attaching components | William Hamburgen | 1993-08-31 |
| 5203401 | Wet micro-channel wafer chuck and cooling method | William Hamburgen | 1993-04-20 |
| 5130889 | Integrated circuit protection by liquid encapsulation | William Hamburgen | 1992-07-14 |
| 5115858 | Micro-channel wafer cooling chuck | William Hamburgen | 1992-05-26 |