MK

Masayoshi Kamai

OU Osaka University: 2 patents #362 of 1,984Top 20%
JA Japan Science And Technology Agency: 1 patents #756 of 2,171Top 35%
Overall (All Time): #1,350,820 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11872651 Dissimilar material solid phase bonding method, dissimilar material solid phase bonded structure, and dissimilar material solid phase bonding device Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki 2024-01-16
11745287 Metal material solid-phase bonding method and solid-phase bonding device Hidetoshi Fujii, Yoshiaki Morisada, Huihong LIU, Yasuhiro Aoki 2023-09-05
7567037 High frequency power supply device and plasma generator Yuichi Setsuhara, Tatsuo Shoji 2009-07-28