| 6924172 |
Method of forming a bond pad |
Paule C. Aschieri |
2005-08-02 |
| 5650356 |
Method for reducing corrosion in openings on a semiconductor wafer |
Gordon M. Grivna, Gregory W. Grynkewich |
1997-07-22 |
| 5453401 |
Method for reducing corrosion of a metal surface containing at least aluminum and copper |
Gordon M. Grivna, Gregory W. Grynkewich |
1995-09-26 |
| 4921572 |
Etchant solutions containing hydrogen fluoride and a polyammonium fluoride salt |
— |
1990-05-01 |
| 4895617 |
Etchant solution for photoresist-patterned metal layers |
Maureen F. Preuss |
1990-01-23 |
| 4871422 |
Etching solutions containing ammonium fluoride and anionic sulfate esters of alkylphenol polyglycidol ethers and method of etching |
Michael Scardera |
1989-10-03 |
| 4863563 |
Etching solutions containing ammonium fluoride and a nonionic alkyl amine glycidol adduct and method of etching |
Michael Scardera |
1989-09-05 |
| 4761244 |
Etching solutions containing ammonium fluoride and an alkyl polyaccharide surfactant |
Michael Scardera |
1988-08-02 |
| 4761245 |
Etching solutions containing ammonium fluoride and an alkylphenol polyglycidol ether surfactant |
Michael Scardera |
1988-08-02 |
