Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7067357 | Semiconductor package and method of fabricating same | Takahiro Oka | 2006-06-27 |
| 7063799 | Ink jet recording head, manufacturing method therefor, and substrate for ink jet recording head manufacture | Kazuhiro Hayakawa | 2006-06-20 |
| 7026699 | Semiconductor device and method for fabricating the same | Noritaka Anzai | 2006-04-11 |
| 7012339 | Semiconductor chip with passive element in a wiring region of the chip | — | 2006-03-14 |
| 6952048 | Semiconductor device with improved design freedom of external terminal | — | 2005-10-04 |
| 6936769 | Electronic part mounting substrate, electronic part, and semiconductor device | Takashi Noguchi, Masahiro Machida, Yuichi Deushi | 2005-08-30 |
| 6869168 | Liquid ejection print head | — | 2005-03-22 |
| 6833607 | Resin-molded semiconductor device that includes at least one additional electronic part | Noritaka Anzai | 2004-12-21 |
| 6831354 | Semiconductor package and method of fabricating same | Takahiro Oka | 2004-12-14 |
| 6806564 | Semiconductor apparatus with decoupling capacitor | Noritaka Anzai | 2004-10-19 |
| 6707146 | Semiconductor apparatus with decoupling capacitor | Noritaka Anzai | 2004-03-16 |
| 6608375 | Semiconductor apparatus with decoupling capacitor | Noritaka Anzai | 2003-08-19 |
| 6582053 | Method for manufacturing a liquid jet recording head and a liquid jet recording head manufactured by such method | — | 2003-06-24 |
| 6538319 | Semiconductor device | — | 2003-03-25 |
| 6534879 | Semiconductor chip and semiconductor device having the chip | — | 2003-03-18 |
| 6472732 | BGA package and method for fabricating the same | — | 2002-10-29 |
| 6467884 | Substrate unit for liquid discharging head, method for producing the same, liquid discharging head, cartridge, and image forming apparatus | Fumio Murooka, Kei Fujita, Yukihiro Hayakawa | 2002-10-22 |
| 6390606 | Ink-jet head, ink-jet head substrate, and a method for making the head | Hirokazu Komuro, Norio Ohkuma | 2002-05-21 |
| 6225694 | Semiconductor device | — | 2001-05-01 |
| 6126271 | Method for manufacturing a liquid jet recording head held in place by a vacuum using a single-point bonder with a particular tip construction and a head manufactured by this method | — | 2000-10-03 |
| 6060774 | Semiconductor device | — | 2000-05-09 |