Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11683019 | Surface acoustic wave device | Naoto Matsuoka, Susumu Yoshimoto | 2023-06-20 |
| 8830550 | Light deflector, method of manufacturing light deflector, and image display device | Yasushi Mizoguchi, Osamu Kobayashi | 2014-09-09 |
| 8610987 | Optical device, optical scanner, and image forming apparatus | Yasushi Mizoguchi | 2013-12-17 |
| 8553305 | Light deflecting element, light deflector, and image forming device | Yasushi Mizoguchi | 2013-10-08 |
| 8537447 | Actuator, optical scanner and image forming apparatus | Yasushi Mizoguchi, Mitsuhiro Yoda | 2013-09-17 |
| 8454173 | Image forming apparatus | Akihiro Murata, Yasushi Mizoguchi, Takuya Nakajima | 2013-06-04 |
| 8355191 | Actuator, optical scanner and image forming apparatus | Yasushi Mizoguchi, Mitsuhiro Yoda | 2013-01-15 |
| 8331003 | Optical deflector and method of manufacturing the same | Yasushi Mizoguchi | 2012-12-11 |
| 8294970 | Actuator, optical scanner, and image forming apparatus | Yasushi Mizoguchi | 2012-10-23 |
| 8089673 | Actuator, optical scanner, and image forming apparatus | Yasushi Mizoguchi | 2012-01-03 |
| 7829365 | Micro electro-mechanical system and method of manufacturing the same | — | 2010-11-09 |
| 7176127 | Method of manufacturing semiconductor device having through hole with adhesion layer thereon | — | 2007-02-13 |
| 7049703 | Semiconductor device having a tapered interconnection with insulating material on conductive sidewall thereof within through hole | — | 2006-05-23 |
| 6900131 | Method of manufacturing semiconductor device | — | 2005-05-31 |
| 6893960 | Method for manufacturing a semiconductor device | — | 2005-05-17 |
| 6475901 | Method for manufacturing semiconductor device having a multi-layer interconnection | Hidetomo Nishimura | 2002-11-05 |
| 6368959 | Method of manufacturing semiconductor device | — | 2002-04-09 |
| 6329719 | Semiconductor device | — | 2001-12-11 |
| 6306762 | Semiconductor device having multi-layered metalization and method of manufacturing the same | Yasuhiro Fukuda, Yasuyuki Tatara, Yusuke Harada, Hiroshi Onoda | 2001-10-23 |
| 6288450 | Wiring structure for semiconductor device | Tadashi Narita | 2001-09-11 |
| 6166442 | Semiconductor device | — | 2000-12-26 |
| 5646449 | Semiconductor device having a multi-layered conductive structure which includes an aluminum alloy layer, a high melting temperature metal layer, and a high melting temperature nitride layer | Yasuhiro Fukuda, Yasuyuki Tatara, Yusuke Harada, Hiroshi Onoda | 1997-07-08 |