Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6306762 | Semiconductor device having multi-layered metalization and method of manufacturing the same | Makiko Nakamura, Yasuhiro Fukuda, Yusuke Harada, Hiroshi Onoda | 2001-10-23 |
| 5646449 | Semiconductor device having a multi-layered conductive structure which includes an aluminum alloy layer, a high melting temperature metal layer, and a high melting temperature nitride layer | Makiko Nakamura, Yasuhiro Fukuda, Yusuke Harada, Hiroshi Onoda | 1997-07-08 |