WK

Wan Foong Kho

NU Nxp Usa: 1 patents #1,089 of 2,066Top 55%
📍 Petaling Jaya, MY: #46 of 109 inventorsTop 45%
Overall (All Time): #2,971,309 of 4,157,543Top 75%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9799617 Methods for repackaging copper wire-bonded microelectronic die Mitchell Curiel, Huan Gim Chan 2017-10-24