HC

Huan Gim Chan

NU Nxp Usa: 1 patents #1,089 of 2,066Top 55%
📍 Subang Jaya, MY: #8 of 26 inventorsTop 35%
Overall (All Time): #2,971,310 of 4,157,543Top 75%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9799617 Methods for repackaging copper wire-bonded microelectronic die Mitchell Curiel, Wan Foong Kho 2017-10-24