Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9240390 | Semiconductor packages having wire bond wall to reduce coupling | Shun-Meen Kuo, Paul R. Hart | 2016-01-19 |
| 8890339 | Self-defining, low capacitance wire bond pad | Fernando A. Santos, Mohd Salimin Sahludin | 2014-11-18 |
| 8134241 | Electronic elements and devices with trench under bond pad feature | Jeffrey K. Jones, Michele L. Miera, Xiaowei Ren, Wayne R. Burger, Mark Arwyn Bennett +1 more | 2012-03-13 |
| 7998852 | Methods for forming an RF device with trench under bond pad feature | Jeffrey K. Jones, Michele L. Miera, Xiaowei Ren, Wayne R. Burger, Mark Arwyn Bennett +1 more | 2011-08-16 |