Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8395399 | Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization | Lucie A. Rousseville, Serge Bardy, Philippe Le Duc | 2013-03-12 |