Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8790742 | Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections | Kenneth H. Church, Patrick Clark, Dongjiang Xu, Bryan Andrew Irwin, Vladimir Pelekhaty | 2014-07-29 |
| 7972650 | Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections | Kenneth H. Church, Patrick Clark, Dongjiang Xu, Bryan Andrew Irwin, Vladimir Pelekhaty | 2011-07-05 |