Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6037192 | Process of assembling an integrated circuit and a terminal substrate using solder reflow and adhesive cure | Elizabeth M. Tencer, Michal Stefan Tencer, William T. Davies, Richard Kubin | 2000-03-14 |