Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6044549 | Assembly of electronic components onto substrates | — | 2000-04-04 |
| 6037192 | Process of assembling an integrated circuit and a terminal substrate using solder reflow and adhesive cure | Sorin Witzman, Elizabeth M. Tencer, Michal Stefan Tencer, William T. Davies | 2000-03-14 |
| 5912438 | Assembly of electronic components onto substrates | — | 1999-06-15 |