Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6410615 | Semiconductor sealing epoxy resin composition and semiconductor device using the same | Takashi Taniguchi, Minoru Yamane, Tsutomu Nishioka, Tadaaki Harada, Toshitsugu Hosokawa +2 more | 2002-06-25 |
| 6144108 | Semiconductor device and method of fabricating the same | Yuji Hotta, Seiji Kondo | 2000-11-07 |
| 5904505 | Process for producing encapsulated semiconductor device having metal foil material covering and metal foil | Yuji Hotta, Hitomi Shigyo, Seiji Kondoh | 1999-05-18 |
| 5846477 | Production method for encapsulating a semiconductor device | Yuji Hotta, Hitomi Shigyo | 1998-12-08 |
| 5834850 | Encapsulated semiconductor device having metal foil covering, and metal foil | Yuji Hotta, Hitomi Shigyo, Seiji Kondoh | 1998-11-10 |