Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6319619 | Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device | Yuko Yamamoto, Miho Yamaguchi | 2001-11-20 |
| 6117513 | Semiconductor device and a lamination and fixing material used in the method of manufacture of the semiconductor device | Yuuji Hotta | 2000-09-12 |
| 5904505 | Process for producing encapsulated semiconductor device having metal foil material covering and metal foil | Yuji Hotta, Shinichi Ohizumi, Seiji Kondoh | 1999-05-18 |
| 5846477 | Production method for encapsulating a semiconductor device | Yuji Hotta, Shinichi Ohizumi | 1998-12-08 |
| 5834850 | Encapsulated semiconductor device having metal foil covering, and metal foil | Yuji Hotta, Shinichi Ohizumi, Seiji Kondoh | 1998-11-10 |
| 5674343 | Method for manufacturing a semiconductor | Yuuji Hotta | 1997-10-07 |