Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8568589 | Connection member and separation membrane module using the same | Yasuhiro Uda, Toshimitsu Hamada, Masashi Beppu, Shinichi Chikura, Masakatsu Takata | 2013-10-29 |
| 7237332 | Method of manufacturing wiring board | Toshiyuki Kawashima, Kenichi Ikeda | 2007-07-03 |
| 7121000 | Method for manufacturing multilayer wiring board | Toshiyuki Kawashima, Kenichi Ikeda | 2006-10-17 |
| 7022373 | Method of forming composite insulating layer and process of producing wiring board | Toshiyuki Kawashima | 2006-04-04 |
| 7017264 | Method of manufacturing multilayer wiring board | Kenichi Ikeda, Toshiyuki Kawashima, Kazuo Oouchi | 2006-03-28 |
| 6807729 | Method of manufacturing metal foil | Toshiyuki Kawashima, Kenichi Ikeda | 2004-10-26 |
| 6773572 | Method of metal layer formation and metal foil-based layered product | Toshiyuki Kawashima, Kenichi Ikeda | 2004-08-10 |
| 6761790 | Wiring board and method of manufacturing the same | Toshiyuki Kawashima, Kenichi Ikeda | 2004-07-13 |
| 6759082 | Metal foil laminated plate and method of manufacturing the same | Kenichi Ikeda, Toshiyuki Kawashima | 2004-07-06 |
| 6596406 | Wiring board prepreg and manufacturing method thereof | Kenichi Ikeda, Toshiyuki Kawashima | 2003-07-22 |