Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7238087 | Planarizing device and a planarization method for semiconductor substrates | Moriyuki Kashiwa, Kazuo Kobayashi | 2007-07-03 |
| 5308644 | Method for manufacturing a printed wiring board having a shield layer | Shin Kawakami, Satoshi Haruyama | 1994-05-03 |
| 5294755 | Printed wiring board having shielding layer | Shin Kawakami, Satoshi Haruyama | 1994-03-15 |
| 5268535 | Printed wiring board | Shin Kawakami, Satoshi Haruyama | 1993-12-07 |
| 5268194 | Method of packing filler into through-holes in a printed circuit board | Shin Kawakami, Satoshi Haruyama | 1993-12-07 |
| 5266748 | Printed wiring board having through-holes covered with ink layer and method of manufacture thereof | Shin Kawakami, Katsutomo Nikaido, Junichi Ichikawa, Yoshio Nishiyama | 1993-11-30 |
| 5262596 | Printed wiring board shielded from electromagnetic wave | Shin Kawakami, Katsutomo Nikaido, Junichi Ichikawa, Yoshio Nishiyama | 1993-11-16 |
| 5240737 | Method of manufacturing printed circuit boards | Shin Kawakami, Junichi Ichikawa | 1993-08-31 |
| 5236736 | Method for manufacturing an electromagnetic wave shield printed wiring board | Shin Kawakami, Katsutomo Nikaido, Yoshio Nishiyama | 1993-08-17 |
| 5234745 | Method of forming an insulating layer on a printed circuit board | Shin Kawakami, Satoshi Haruyama | 1993-08-10 |
| 5220135 | Printed wiring board having shielding layer | Shin Kawakami, Satoshi Haruyama | 1993-06-15 |
| 5219607 | Method of manufacturing printed circuit board | Shin Kawakami, Satoshi Haruyama | 1993-06-15 |
| 5210940 | Method of producing a printed circuit board | Shin Kawakami, Junichi Ichikawa | 1993-05-18 |
| 5210379 | Printed wiring board with electromagnetic wave shielding layer | Katsutomo Nikaido, Junichi Ichikawa | 1993-05-11 |
| 5196230 | Method for connecting an electromagnetic wave shielding layer with a ground circuit in a printed circuit board | Katsutomo Nikaido, Junichi Ichikawa | 1993-03-23 |
| 5195238 | Method of manufacturing a printed circuit board | Shin Kawakami, Katsutomo Nikaido, Junichi Ichikawa, Yoshio Nishiyama | 1993-03-23 |
| 5191709 | Method of forming through-holes in printed wiring board | Shin Kawakami, Satoshi Haruyama | 1993-03-09 |
| 5145691 | Apparatus for packing filler into through-holes or the like in a printed circuit board | Shin Kawakami, Satoshi Haruyama | 1992-09-08 |
| 5133120 | Method of filling conductive material into through holes of printed wiring board | Shin Kawakami, Satoshi Haruyama | 1992-07-28 |
| 5112648 | Method of manufacturing a printed circuit board | Katsutomo Nikaido, Junichi Ichikawa, Yoshio Nishiyama | 1992-05-12 |
| 5100695 | Method of manufacturing a printed circuit board | Shin Kawakami, Satoshi Haruyama | 1992-03-31 |
| 5030800 | Printed wiring board with an electronic wave shielding layer | Shin Kawakami, Satoshi Haruyama | 1991-07-09 |
| 5028743 | Printed circuit board with filled throughholes | Shin Kawakami, Satoshi Haruyama | 1991-07-02 |
| 4991060 | Printed circuit board having conductors interconnected by foamed electroconductive paste | Shin Kawakami, Satoshi Haruyama | 1991-02-05 |
| 4929491 | Printed wiring board | Shin Kawakami, Satoshi Haruyama | 1990-05-29 |