Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243799 | Electronic packages with integral heat spreaders | Charles Bailley, Daniel M. Kinzer | 2025-03-04 |
| 12199004 | Electronic packages with integral heat spreaders | Charles Bailley, Daniel M. Kinzer | 2025-01-14 |
| 10026707 | Wafer level package and method | — | 2018-07-17 |
| 7501693 | LDO regulator with ground connection through package bottom | Martin Alter | 2009-03-10 |
| 4975761 | High performance plastic encapsulated package for integrated circuit die | — | 1990-12-04 |