Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11865518 | Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate | Yu-Hsiang Kao | 2024-01-09 |
| 11745469 | Conductive laminate and method for manufacturing the same | Wei Wang | 2023-09-05 |
| 11331883 | Diffusion barrier structure, and conductive laminate and manufacturing method thereof | Wei Wang | 2022-05-17 |
| 11313670 | Inspection method for multilayer semiconductor device | Mikhail Pylnev, Duc-Anh Le | 2022-04-26 |
| 11098407 | Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom | Chin-Wei Hsu, Wei Wang | 2021-08-24 |
| 10883193 | Method for preparing perovskite crystal | Ko-Chi Teng | 2021-01-05 |
| 10828624 | Self-adsorbed catalyst composition, method for preparing the same and method for manufacturing electroless plating substrate | Yu-Hsiang Kao | 2020-11-10 |
| 9875984 | Substrate surface metallization method and substrate having metallized surface manufactured by the same | Chih-Ming Chen, TSENG-CHIEH PAN, Kuei-Chang Lai, Chung-Han Wu, Kuei-Po Chen +2 more | 2018-01-23 |
| 9514965 | Substrate surface metallization method and substrate having metallized surface manufactured by the same | Chih-Ming Chen, TSENG-CHIEH PAN, Kuei-Chang Lai, Chung-Han Wu, Kuei-Po Chen +2 more | 2016-12-06 |
| 8349394 | Method of forming an electrode including an electrochemical catalyst layer | Chao Peng, Jo-Lin Lan, Ya-Huei Chang, Wen-Chi Hsu, Hai-Peng Cheng +2 more | 2013-01-08 |
| 8298434 | Method of forming an electrode including an electrochemical catalyst layer | Hai-Peng Cheng, Shien-Ping Feng, Jo-Lin Lan, Chao Peng, Wen-Chi Hsu +2 more | 2012-10-30 |
| 8241372 | Electrochemical device and method of fabricating the same | Hai-Peng Cheng, Shien-Ping Feng, Jo-Lin Lan, Chao Peng, Wen-Chi Hsu +2 more | 2012-08-14 |
| 7838065 | Method for preparing an electrode comprising an electrochemical catalyst layer thereon | Chi-Chao Wan, Yeng-Yun Wang, Hui TANG | 2010-11-23 |