Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11067459 | Stress sensor structure and a manufacturing method thereof | Wen Yin, Heng Yang, Chuanguo Dou, Wenqi Zhang, Liqiang Cao | 2021-07-20 |
| 9653378 | Heat dissipation solution for advanced chip packages | Fengze Hou | 2017-05-16 |