FH

Fengze Hou

NC National Center For Advanced Packaging Co.: 1 patents #8 of 22Top 40%
Overall (All Time): #2,945,642 of 4,157,543Top 75%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9653378 Heat dissipation solution for advanced chip packages Tingyu Lin 2017-05-16