Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040292 | Method for forming conductive layer, and conductive structure and forming method therefor | — | 2024-07-16 |
| 11183421 | Interconnection structure of metal lines, method of fabricating the same and semiconductor device | — | 2021-11-23 |
| 8394721 | Method for obtaining a layout design for an existing integrated circuit | Yi-Nan Chen, Hsien-Wen Liu | 2013-03-12 |
| 6403418 | Method of fabricating cup-shape cylindrical capacitor of high density DRAMs | Shiou-Yu Wang, Jia-Shyong Cheng, Tean-Sen Jen | 2002-06-11 |
| 6066541 | Method for fabricating a cylindrical capacitor | Tsu-An Lin, Pei-Ying Lee, Hsing-Chuan Tsai | 2000-05-23 |
| 5923989 | Method of fabricating rugged capacitor of high density DRAMs | Shian-Jyh Lin, Tsu-An Lin, Wen-Chieh Chang, Shiou-Yu Wang, Tean-Sen Jen +2 more | 1999-07-13 |