Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12265112 | Three-terminal power line fault location and correction system and method | Jui-Nien Chou, Shun Chen | 2025-04-01 |
| 9605345 | Vertical furnace for improving wafer uniformity | Eddy Lay, Shih-Min Tseng, Sheng-Wei Wu, Shih-Fang Chen | 2017-03-28 |
| 8157621 | Wafer back side grinding process | — | 2012-04-17 |
| 8143712 | Die package structure | — | 2012-03-27 |
| 7948073 | Three-dimensional package | — | 2011-05-24 |
| 7923852 | Semiconductor package structure with protection bar | — | 2011-04-12 |
| 5795996 | Method and apparatus for monitoring water quality | Chen-Chang Chang, Shu-Fei Chan, Dong Lin, Guo Chen, Don H. C. Chen | 1998-08-18 |