Issued Patents All Time
Showing 76–100 of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10349512 | High-frequency module | Issei Yamamoto, Takuya Murayama, Tadashi Nomura | 2019-07-09 |
| 10342116 | High-frequency module | Yoshihisa Masuda | 2019-07-02 |
| 10312172 | High-frequency module | — | 2019-06-04 |
| 10271423 | Flexible substrate | — | 2019-04-23 |
| 10231331 | Multilayer wiring board and probe card having the same | Takayuki Tsukizawa | 2019-03-12 |
| 10219362 | ESD protection device | — | 2019-02-26 |
| 10178774 | Ceramic electronic component and manufacturing method thereof | Kunio IWAKOSHI, Syuichi ONODERA, Takao Okano | 2019-01-08 |
| RE47147 | ESD protection device and method for producing the same | — | 2018-11-27 |
| 10080280 | Resin multilayer substrate | Norio Sakai | 2018-09-18 |
| 10056311 | Electronic circuit module | Muneyoshi YAMAMOTO, Norio Sakai | 2018-08-21 |
| 10021787 | Resin substrate combined structure | Keisuke Araki, Yuki Ito, Kenji Kubota | 2018-07-10 |
| 9961768 | Multilayer wiring substrate, manufacturing method therefor, and substrate for probe card | Toru Meguro, Tatsunori Kan | 2018-05-01 |
| 9936575 | Resin multilayer substrate and component module | — | 2018-04-03 |
| 9907180 | Multilayer electronic device and manufacturing method therefor | Nobuaki Ogawa | 2018-02-27 |
| 9854680 | Multilayer substrate | — | 2017-12-26 |
| 9837795 | ESD protection device | Jun Adachi | 2017-12-05 |
| 9826611 | ESD protection device | — | 2017-11-21 |
| 9781828 | Module substrate and method for manufacturing module substrate | Issei Yamamoto | 2017-10-03 |
| 9769917 | Resin multilayer substrate | Norio Sakai | 2017-09-19 |
| 9697946 | Electronic component | — | 2017-07-04 |
| 9681534 | Ceramic multilayer substrate | — | 2017-06-13 |
| 9590417 | ESD protective device | — | 2017-03-07 |
| 9538649 | Method of manufacturing module | Nobuaki Ogawa | 2017-01-03 |
| 9523709 | Method of manufacturing multilayer wiring board, probe card including multilayer wiring board manufactured by the method, and multilayer wiring board | — | 2016-12-20 |
| 9526176 | Component-embedded resin substrate | Norio Sakai | 2016-12-20 |