Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12137526 | Bonded body and insulating circuit board | Marina Sakamaki, Toyo Ohashi | 2024-11-05 |
| 11901659 | Terminal material for connectors | Yoshie Tarutani | 2024-02-13 |
| 11781234 | Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products | Naoki Miyashima, Kazunari Maki, Shinichi Funaki | 2023-10-10 |
| 11761109 | Terminal material for connector | Yoshie Tarutani, Naoki Katou | 2023-09-19 |
| 11753733 | Method for producing high-purity electrolytic copper | Yoshie Tarutani, Kiyotaka Nakaya, Isao Arai | 2023-09-12 |
| 11661667 | Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structure | Yoshie Tarutani, Takashi Tamagawa, Kiyotaka Nakaya | 2023-05-30 |
| 11530490 | Terminal material with silver coating film and terminal with silver coating film | Tooru Nishimura, Takashi Tamagawa, Kiyotaka Nakaya | 2022-12-20 |
| 11453953 | High-purity electrolytic copper | Yoshie Tarutani, Kiyotaka Nakaya, Isao Arai | 2022-09-27 |
| 11264750 | Tin-plated copper terminal material, terminal, and electric-wire terminal structure | Yoshie Tarutani, Kiyotaka Nakaya | 2022-03-01 |
| 11211729 | Terminal material for connectors, terminal, and electric wire termination structure | Yoshie Tarutani, Kiyotaka Nakaya | 2021-12-28 |
| 11088472 | Tin-plated copper terminal material, terminal, and wire terminal part structure | Yoshie Tarutani, Kiyotaka Nakaya | 2021-08-10 |
| 10910130 | Corrosion-resistant terminal material, corrosion-resistant terminal, and wire-end structure | Yoshie Tarutani, Kiyotaka Nakaya | 2021-02-02 |
| 10858750 | Tin-plated copper terminal material, terminal and electric wire terminal-end structure | Yoshie Tarutani, Takashi Tamagawa, Kiyotaka Nakaya | 2020-12-08 |
| 10801115 | Tinned copper terminal material, terminal, and electrical wire end part structure | Yoshie Tarutani, Kiyotaka Nakaya | 2020-10-13 |
| 10793956 | Additive for high-purity copper electrolytic refining and method of producing high-purity copper | Yoshie Tarutani, Kiyotaka Nakaya | 2020-10-06 |
| 10428434 | Additive for high-purity copper electrolytic refining, method of producing high-purity copper, and high-purity electrolytic copper | Yoshie Tarutani, Kiyotaka Nakaya | 2019-10-01 |
| 10407785 | Additive for high-purity copper electrolytic refining and method of producing high-purity copper | Yoshie Tarutani, Kiyotaka Nakaya | 2019-09-10 |
| 10358730 | Additive for high-purity copper electrolytic refining and method of producing high-purity copper | Yoshie Tarutani, Kiyotaka Nakaya | 2019-07-23 |
| 10301737 | Method of manufacturing tin-plated copper terminal material | Yoshie Tarutani, Kiyotaka Nakaya | 2019-05-28 |
| 10280347 | Semiconductor device manufacturing method and underfill film | Takayuki Saito | 2019-05-07 |
| 10021787 | Resin substrate combined structure | Yoshihito Otsubo, Keisuke Araki, Yuki Ito | 2018-07-10 |
| 9616639 | Tin-plated copper-alloy material for terminal having excellent insertion/extraction performance | Yuki Taninouchi, Naoki Kato | 2017-04-11 |
| 9460550 | Multi-viewpoint image generation apparatus and method | — | 2016-10-04 |
| 8981233 | Conductive member and method for producing the same | Takeshi Sakurai, Seiichi Ishikawa, Takashi Tamagawa | 2015-03-17 |
| 8976171 | Depth estimation data generating apparatus, depth estimation data generating method, and depth estimation data generating program, and pseudo three-dimensional image generating apparatus, pseudo three-dimensional image generating method, and pseudo three-dimensional image generating program | Shingo Kida | 2015-03-10 |