Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901659 | Terminal material for connectors | Kenji Kubota | 2024-02-13 |
| 11761109 | Terminal material for connector | Kenji Kubota, Naoki Katou | 2023-09-19 |
| 11753733 | Method for producing high-purity electrolytic copper | Kenji Kubota, Kiyotaka Nakaya, Isao Arai | 2023-09-12 |
| 11661667 | Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structure | Kenji Kubota, Takashi Tamagawa, Kiyotaka Nakaya | 2023-05-30 |
| 11453953 | High-purity electrolytic copper | Kenji Kubota, Kiyotaka Nakaya, Isao Arai | 2022-09-27 |
| 11264750 | Tin-plated copper terminal material, terminal, and electric-wire terminal structure | Kenji Kubota, Kiyotaka Nakaya | 2022-03-01 |
| 11211729 | Terminal material for connectors, terminal, and electric wire termination structure | Kenji Kubota, Kiyotaka Nakaya | 2021-12-28 |
| 11088472 | Tin-plated copper terminal material, terminal, and wire terminal part structure | Kenji Kubota, Kiyotaka Nakaya | 2021-08-10 |
| 10910130 | Corrosion-resistant terminal material, corrosion-resistant terminal, and wire-end structure | Kenji Kubota, Kiyotaka Nakaya | 2021-02-02 |
| 10858750 | Tin-plated copper terminal material, terminal and electric wire terminal-end structure | Kenji Kubota, Takashi Tamagawa, Kiyotaka Nakaya | 2020-12-08 |
| 10801115 | Tinned copper terminal material, terminal, and electrical wire end part structure | Kenji Kubota, Kiyotaka Nakaya | 2020-10-13 |
| 10793956 | Additive for high-purity copper electrolytic refining and method of producing high-purity copper | Kenji Kubota, Kiyotaka Nakaya | 2020-10-06 |
| 10428434 | Additive for high-purity copper electrolytic refining, method of producing high-purity copper, and high-purity electrolytic copper | Kenji Kubota, Kiyotaka Nakaya | 2019-10-01 |
| 10407785 | Additive for high-purity copper electrolytic refining and method of producing high-purity copper | Kenji Kubota, Kiyotaka Nakaya | 2019-09-10 |
| 10358730 | Additive for high-purity copper electrolytic refining and method of producing high-purity copper | Kenji Kubota, Kiyotaka Nakaya | 2019-07-23 |
| 10301737 | Method of manufacturing tin-plated copper terminal material | Kenji Kubota, Kiyotaka Nakaya | 2019-05-28 |