Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11864313 | Multilayer wiring substrate | Atsushi Kishimoto, Shuichi Kawata, Hiroshi Nishikawa | 2024-01-02 |
| 11284533 | Cooling module and circuit board | Shuichi Kawata, Takafumi MORIASA, Masahiko Shigaki, Yuichi Kusano, Norihiro Kawahara | 2022-03-22 |