Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11703040 | Pump and cooling substrate | Takafumi MORIASA, Shuichi Kawata, Yuichi Kusano | 2023-07-18 |
| 11284533 | Cooling module and circuit board | Shuichi Kawata, Takafumi MORIASA, Masatoshi Kakue, Yuichi Kusano, Norihiro Kawahara | 2022-03-22 |
| 11008420 | Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | Kentaro Takano | 2021-05-18 |