Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640860 | Circuit module and interposer | Hirokazu Yazaki, Takanori Tsuchiya | 2023-05-02 |
| 11450451 | Circuit module and interposer | Hirokazu Yazaki, Takanori Tsuchiya | 2022-09-20 |
| 11166386 | Interposer substrate, circuit module, and interposer substrate manufacturing method | Hirokazu Yazaki, Takanori Tsuchiya, Koji KAMADA | 2021-11-02 |
| 11032904 | Interposer substrate and circuit module | Hirokazu Yazaki, Takanori Tsuchiya, Koji KAMADA, Takashi Noma | 2021-06-08 |
| 11024571 | Coil built-in multilayer substrate and power supply module | — | 2021-06-01 |
| 10964645 | Electronic component with thin-film shield layer | Hirokazu Yazaki | 2021-03-30 |
| 10869382 | Interposer and electronic apparatus | Hirokazu Yazaki | 2020-12-15 |
| 10645798 | Composite component-embedded circuit board and composite component | Hirokazu Yazaki | 2020-05-05 |
| 10616991 | Interposer and electronic apparatus | Hirokazu Yazaki | 2020-04-07 |
| 10609820 | Electronic component module, DC-DC converter, and electronic device | — | 2020-03-31 |
| 10264674 | Passive element array and printed wiring board | Hirokazu Yazaki | 2019-04-16 |
| 10264676 | Passive element array and printed wiring board | Hirokazu Yazaki | 2019-04-16 |