Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5886396 | Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package | William Strom | 1999-03-23 |
| 5587883 | Lead frame assembly for surface mount integrated circuit power package | Timothy L. Olson, Gary Carl Johnson, William Strom | 1996-12-24 |