Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974749 | Bottom oxide formation process for preventing formation of voids in trench | Shih-Chi Lai, Yifu Chung, Yi Yang, Jen-Chieh Chang, Chun-De Lin | 2005-12-13 |
| 6699789 | Metallization process to reduce stress between Al-Cu layer and titanium nitride layer | Zhih-Sheng Yang, Chung Yan Cheng, Ying-Yan Huang | 2004-03-02 |
| 6326320 | Method for forming oxide layer on conductor plug of trench structure | Yi Yang, Mike SU | 2001-12-04 |
| 6310688 | Method for measuring the parameter of a rough film | Ming-Kuan Kao | 2001-10-30 |
| 6265233 | Method for determining crack limit of film deposited on semiconductor wafer | Jerry C. S. Lin, Roger Tun-Fu Hung, Chih-Ta Wu | 2001-07-24 |
| 6242365 | Method for preventing film deposited on semiconductor wafer from cracking | Jerry C. S. Lin, Roger Tun-Fu Hung, Chih-Ta Wu | 2001-06-05 |