Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492263 | Dual damascene process which prevents diffusion of metals and improves trench-to-via alignment | Hsin-Tang Peng, Chun-Wei Chen | 2002-12-10 |
| 5760484 | Alignment mark pattern for semiconductor process | Chang-Hsun Lee, Chen-Tai Kuo | 1998-06-02 |