Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5266654 | Resin composition | Mikio Kitahara, Koichi Machida, Takayuki Kubo, Koutarou Asahina, Junsuke Tanaka +1 more | 1993-11-30 |
| 5120803 | Resin compositions for sealing semiconductor | Mikio Kitahara, Koichi Machida, Takayuki Kubo, Koutarou Asahina | 1992-06-09 |
| 5082880 | Semiconductor sealing composition containing epoxy resin and polymaleimide | Mikio Kitahara, Koichi Machida, Takayuki Kubo, Koutarou Asahina | 1992-01-21 |
| 5079331 | Heat-resistant epoxy resin composition based on 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane | Mikio Kitahara, Koichi Machida, Takayuki Kubo, Koutarou Asahina, Yoshimitsu Tanabe +2 more | 1992-01-07 |
| 5015674 | Composition of vinyl polymer-grafted, silicone polymer-modified epoxy resin and polymaleimide | Koichi Machida, Mikio Kitahara, Takayuki Kubo, Koutarou Asahina | 1991-05-14 |
| 4904761 | Resin composition for sealing semiconductors | Yuji Okitsu, Koichi Machida, Junko Tsuji, Kotaro Asahina, Kazuya Shinkoda +2 more | 1990-02-27 |
| 4886704 | Strippable coating film and coating method using same | Keiichi Kamada, Yasuo Ohkita | 1989-12-12 |