Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6340518 | Flexible metal-clad laminates and preparation of the same | Minehiro Mori, Naoshi Mineta, Takashi Kayama | 2002-01-22 |
| 5266654 | Resin composition | Koichi Machida, Takayuki Kubo, Motoyuki Torikai, Koutarou Asahina, Junsuke Tanaka +1 more | 1993-11-30 |
| 5134204 | Resin composition for sealing semiconductors | Motoyuki Toriakai, Koutarou Asahina, Koichi Machida, Takayuki Kubo | 1992-07-28 |
| 5120803 | Resin compositions for sealing semiconductor | Koichi Machida, Takayuki Kubo, Motoyuki Torikai, Koutarou Asahina | 1992-06-09 |
| 5082880 | Semiconductor sealing composition containing epoxy resin and polymaleimide | Koichi Machida, Takayuki Kubo, Motoyuki Torikai, Koutarou Asahina | 1992-01-21 |
| 5079331 | Heat-resistant epoxy resin composition based on 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane | Koichi Machida, Takayuki Kubo, Motoyuki Torikai, Koutarou Asahina, Yoshimitsu Tanabe +2 more | 1992-01-07 |
| 5015674 | Composition of vinyl polymer-grafted, silicone polymer-modified epoxy resin and polymaleimide | Koichi Machida, Takayuki Kubo, Motoyuki Torikai, Koutarou Asahina | 1991-05-14 |
| 4904761 | Resin composition for sealing semiconductors | Yuji Okitsu, Koichi Machida, Motoyuki Torikai, Junko Tsuji, Kotaro Asahina +2 more | 1990-02-27 |