Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261143 | Method of manufacturing substrate layered body and layered body | Jun Kamada, Yuzo Nakamura | 2025-03-25 |
| 11965109 | Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device | Hirofumi Tanaka, Koji Inoue | 2024-04-23 |
| 11859110 | Substrate laminated body and method of manufacturing substrate laminated body | Jun Kamada, Kazuo Kohmura | 2024-01-02 |
| 11581197 | Method for producing semiconductor device and intermediate for semiconductor device | Jun Kamada, Kaichiro Haruta, Kazuo Kohmura, Yoichi Kodama | 2023-02-14 |
| 11487205 | Semiconductor element intermediate, composition for forming metal-containing film, method of producing semiconductor element intermediate, and method of producing semiconductor element | Hiroko Wachi, Hirofumi Tanaka, Kenichi Fujii | 2022-11-01 |
| 11474429 | Method of producing substrate with fine uneven pattern, resin composition, and laminate | Takashi Oda, Hisanori OHKITA | 2022-10-18 |
| 11209735 | Composition for forming metal-containing film, method of producing composition for forming metal-containing film, semiconductor device, and method of producing semiconductor device | Shoko Ono, Hirofumi Tanaka | 2021-12-28 |
| 10988647 | Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same | Jun Kamada, Kaichiro Haruta, Takashi UNEZAKI, Kiyomi Imagawa, Kenichi Fujii +1 more | 2021-04-27 |
| 10950532 | Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method | Shoko Ono, Hirofumi Tanaka, Koji Inoue, Hiroko Wachi | 2021-03-16 |
| 10759964 | Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor device | Hirofumi Tanaka, Hiroko Wachi, Shoko Ono | 2020-09-01 |
| 10752805 | Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device | Hirofumi Tanaka, Koji Inoue | 2020-08-25 |
| 10580639 | Sealing composition and method of manufacturing semiconductor device | Hirofumi Tanaka, Shoko Ono, Koji Inoue, Hiroko Wachi, Tsuneji Suzuki | 2020-03-03 |
| 10043677 | Method for manufacturing filling planarization film and method for manufacturing electronic device | Hirofumi Tanaka, Hiroko Wachi, Koji Inoue, Shoko Ono | 2018-08-07 |
| 10020238 | Method for manufacturing composite body and composition | Shoko Ono, Hirofumi Tanaka, Tsuneji Suzuki, Shigeru Mio, Kazuo Kohmura | 2018-07-10 |
| 9780008 | Semiconductor device, method for manufacturing the same, and rinsing liquid | Shoko Ono, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki | 2017-10-03 |
| 9169353 | Sealing composition for semiconductor, semiconductor device and method of producing the same, and polymer and method of producing the same | Shoko Ono, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki, Shigeru Mio | 2015-10-27 |