Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7524356 | Method for manufacturing low-oxygen copper | Haruhiko Asao, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi +2 more | 2009-04-28 |
| 6944930 | Method for manufacturing low-oxygen copper | Haruhiko Asao, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi +2 more | 2005-09-20 |
| 6682824 | Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the same | Tutomu Masui, Kazumasa Hori, Yoshiaki Hattori | 2004-01-27 |
| 6640876 | Method and apparatus for manufacturing copper and/or copper alloy ingot having no shrinkage cavity and having smooth surface without wrinkles | Kenji Yajima, Norikazu Ishida, Keiji Nogami, Akihiro Kakimoto | 2003-11-04 |
| 6589473 | Apparatus for manufacturing low-oxygen copper | Haruhiko Asao, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi +2 more | 2003-07-08 |
| 5798008 | Method for producing copper alloy materials for molds for continuous steel casting, and molds made of the materials | Keishi Nogami, Masato Koide, Takashi Morimoto | 1998-08-25 |
| 5705125 | Wire for electric railways | Motoo Goto, Shizuo Kawakita, Yoshiharu Mae, Takuro Iwamura, Kenji Yajima +5 more | 1998-01-06 |
| 5391243 | Method for producing wire for electric railways | Motoo Goto, Shizuo Kawakita, Yoshiharu Mae, Takuro Iwamura, Kenji Yajima +5 more | 1995-02-21 |
| 5024814 | Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated | Rensei Futatasuka, Shunich Chiba, Toyoaki Orikasa, Seiji Noguchi, Takuya Idoshita | 1991-06-18 |